TYPE |
PUBLICATION |
TARIKH PENERBITAN |
TYPE OF CONTRIBUTION |
REFEREED PUBLICATION |
BOOK CHAPTER |
The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth |
01/03/2022 |
Menulis bab dari buku (SCOPUS) |
CONFERENCE PAPER |
Effect of Different Nickel Percentage in Solder Alloy towards Intermetallic Compound Formation and Growth |
01/03/2021 |
International Conference (SCOPUS) |
BOOK CHAPTER |
Kokurikulum dan Pembangunan Mahasiswa Holistik: Teras Tumpuan Dalam Kursus Kokurikulum |
01/09/2020 |
Chapter in book |
BOOK CHAPTER |
A Review on Mechanical Properties of SnAgCu/Cu Joint Using Laser Soldering |
01/03/2019 |
Chapter in book (SCOPUS) |
BOOK CHAPTER |
The Effect of Argon Shielding Gas Flow Rate on Welded 22MnB5 Boron Steel Using Low Power Fiber Laser |
01/04/2019 |
Chapter in book (SCOPUS) |
CONFERENCE PAPER |
Effect of Different Amount of Silicon Carbide on SAC Solder-Cu Joint Performance by Using Microwave Hybrid Heating Method |
01/01/2019 |
International Conference (SCOPUS) |
CONFERENCE PAPER |
Effect of fibre-lasers parameters on interfacial reaction and wetting angle of two different types of SAC305 solder fabrication on Cu pad |
01/01/2019 |
International Conference (SCOPUS) |
JOURNAL |
Characterization of heat-treated gas metal arc-welded boron steel sheets |
01/01/2018 |
International Journal (ISI, Q2) |
CONFERENCE PAPER |
A Study on The Development of Local Exhaust Ventilation System (LEVs) for Installation of Laser Cutting Machine |
01/09/2017 |
International conference (SCOPUS) |
CONFERENCE PAPER |
Hardness variation of welded boron steel using continuous wave (CW) and pulse wave (PW) mode of fiber laser |
01/09/2017 |
International conference (SCOPUS) |
CONFERENCE PAPER |
Investigation on the Effect of Pulsed Energy on Strength of Fillet Lap Laser Welded AZ31B Magnesium Alloys |
01/09/2017 |
International Conference (SCOPUS) |
CONFERENCE PAPER |
Optimization on Laser Soldering Parameters Onto Lead-Free Solder Joint |
01/09/2017 |
International Conference (SCOPUS) |
JOURNAL |
Dissimilar welding of A7075-T651 and AZ31B alloy by gas metal arc plug welding method |
02/01/2017 |
International journal (ISI, Q2) |
JOURNAL |
Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy |
02/01/2017 |
International Journal (SCOPUS) |
JOURNAL |
The effect of pulse welding parameters on weld geometry of boron steel using low power fibre laser |
01/09/2017 |
International Journal (SCOPUS) |
BOOK CHAPTER |
A review on the effect of surface finish and cooling rate on solder joint reliability |
01/01/2016 |
Chapter in book |
BOOKS |
The effect of ER4043 and ER5356 filler metal on welded Al 7075 by metal inert gas welding |
28/11/2016 |
Chapter in book |
CONFERENCE PAPER |
Effects of sintering temperatures on microstructures and mechanical properties of Sn4.0Ag0.5Cu1.0Ni solder alloy |
01/12/2016 |
International Conference (SCOPUS) |
CONFERENCE PAPER |
Wettability Study of Lead Free Solder Paste and Its Effect Towards Multiple Reflow |
01/12/2016 |
International Conference (SCOPUS) |
CONFERENCE PAPER |
Wettability study of lead free solder paste and its effect towards multiple reflow |
01/08/2016 |
International conference (SCOPUS) |
JOURNAL |
A review: lead free solder and its wettability properties |
19/01/2016 |
International journal (ISI, Q4) |
JOURNAL |
Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish |
04/01/2016 |
International Journal (SCOPUS) |
JOURNAL |
Dissimilar welding of A7075-T651 and AZ31B alloys by gasmetal arc plug welding method |
30/05/2016 |
International journal (ISI, Q2) |
JOURNAL |
Effect of Immersion Coating Deposition Time on Solder Joint Properties |
01/04/2016 |
International journal (SCOPUS) |
JOURNAL |
Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish |
11/07/2016 |
International journal (SCOPUS) |
JOURNAL |
Intermetallic growth and shear strength of SAC305/EN-Boron |
21/01/2016 |
International journal (ISI, Q4) |
CONFERENCE PAPER |
Effect of Flux onto Intermetallic Compound Formation and Growth |
01/08/2015 |
International conference (SCOPUS) |
JOURNAL |
Effect of reflow soldering profile on intermetallic compound formation |
01/04/2015 |
International journal (SCOPUS) |
JOURNAL |
Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes |
01/12/2015 |
International Journal (SCOPUS) |
CONFERENCE PAPER |
Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy |
01/04/2014 |
International Conference (SCOPUS) |
CONFERENCE PAPER |
Microstructure Evolution at the Solder Joint During Isothermal Aging |
11/11/2014 |
International Conference (SCOPUS) |
JOURNAL |
Effect Of Solder Volume On Interfacial Reaction Between
SAC405 Solders And EN(B)EPIG Surface Finish |
01/12/2014 |
International Journal (SCOPUS) |
JOURNAL |
Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating |
09/09/2014 |
International journal (SCOPUS) |
JOURNAL |
Study of resistance spot welding between aisi 301 stainless steel and AISI 1020 carbon steel dissimilar alloys |
01/06/2014 |
International Journal (SCOPUS) |
JOURNAL |
Effect of Reinforcement Alignment to the Properties of Polymer Matrix Composite |
01/06/2013 |
International Journal (SCOPUS) |
JOURNAL |
Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5 Cu solders |
01/11/2013 |
International Journal (SCOPUS) |
JOURNAL |
Intermetallic evolution for isothermal aging up to 2000 hours on Sn-4Ag-0.5 Cu and Sn-37Pb solders with Ni/Au layers |
01/07/2013 |
International Journal (SCOPUS) |
CONFERENCE PAPER |
Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper |
08/11/2012 |
International Conference (SCOPUS) |
JOURNAL |
Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish |
01/11/2012 |
International Journal (SCOPUS) |
JOURNAL |
Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate |
01/12/2012 |
International Journal (SCOPUS) |
JOURNAL |
Effect of Rice Husk as Filler in Polymer Matrix Composites |
01/06/2012 |
International Journal (SCOPUS) |
JOURNAL |
Effect of multiple reflow on IMC formation using various surface finishes |
01/08/2012 |
International Journal (SCOPUS) |
JOURNAL |
Effect of Surface Finish on Intermetallic Compound Formation During Soldering With Ni-Doped Solders |
01/12/2011 |
International Journal (ISI, Q2) |
CONFERENCE PAPER |
Effect of Surface Finish Metallurgy on Intermetallic Compounds During Soldering with Tin-Silver-Copper Solders |
12/07/2010 |
International Conference (SCOPUS) |
CONFERENCE PAPER |
Interfacial Reactions of SAC305 and SAC405 Solders on Electroless Ni(P)/ Immersion Au and Electroless Ni(B)/ Immersion Au Finishes |
02/12/2010 |
International Conference (SCOPUS) |
JOURNAL |
Effect Of Solder Bump Size On Interfacial Reactions During Soldering Between Pb-Free Solder And Cu And Cu Ni/Pd/Au Surface Finishes |
01/05/2010 |
International Journal (SCOPUS) |
JOURNAL |
Effect of Silver Content on Intermetallics Formation On Copper and Immersion Silver Surface Finishes |
01/12/2009 |
International Journal |
CONFERENCE PAPER |
Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish |
01/11/2006 |
International Conference (SCOPUS) |
NON-REFEREED PUBLICATION |
BOOK CHAPTER |
Kokurikulum Institusi Pengajian Tinggi Malaysia: Kokurikulum Institusi Pengajian Tinggi |
01/09/2020 |
Chapter in book |
BOOK CHAPTER |
Kokurikulum Institusi Pengajian Tinggi Malaysia: Masa Depan Kursus Kokurikulum |
01/09/2020 |
Chapter in book |
CONFERENCE PAPER |
Keberkesanan Program Latihan Luar Iaitu Selaman Scuba Di Lautan Terbuka Ke Atas Pembangunan Diri Pelatih Kor-Suksis Universiti Malaysia Pahang |
01/01/2019 |
National Conference |
CONFERENCE PAPER |
Penglibatan Pelatih Kor-Suksis Dalam Aktiviti Perkhemahan Dan Sumbangannya Ke Arah Ketahanan Mental Dan Fizikal |
01/01/2019 |
National conference |
CONFERENCE PAPER |
Penglibatan Mahasiswa Gen-Z Dalam Kegiatan Kokurikulum Kampus: Isu Dan Cabaran |
01/01/2018 |
National conference |
JOURNAL |
The Mechanical And Microstructural Study of Welded AA7075 Using Different Filler Metals |
01/09/2017 |
International journal |
BOOKS |
BMM3611 MANUFACTURING PROCESS LABORATORY |
01/09/2016 |
Module for laboratory |
JOURNAL |
The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation |
01/12/2016 |
International journal |
CONFERENCE PAPER |
A review on effect of nickel doping on solder joint reliability |
01/01/2015 |
National Conference |
JOURNAL |
Development Of Diffusion Barrier Layer On Copper-printed Circuit Board Using Electroless Plating Method |
30/04/2015 |
International journal |
CONFERENCE PAPER |
Effect of Bismuth Percentage on Intermetallic
Compound Formation with Immersion Silver and
Copper Surface Finishes |
02/11/2009 |
International Conference |
CONFERENCE PAPER |
Effect of Multiple Reflow On Intermetallic Compound Formation on Copper and Immersion Silver Surface Finishes |
01/12/2009 |
International Conference |
CONFERENCE PAPER |
Effect of Nickel Doping in Sn-Ag-Cu Solders on
Intermetallic Compound Formation with Immersion
Silver and Copper Surface Finishes |
02/11/2009 |
International Conference |
CONFERENCE PAPER |
Effect of Silver Content on Intermetallics Formation on Copper and Immersion Silver Surface Finishes |
30/04/2009 |
International Conference |
CONFERENCE PAPER |
Effect of Solder Volume and Pad Area on Intermetallic Compounds Formation During Soldering Between Sn-4Ag-0.5Cu and Immersion Silver Finish
|
02/03/2009 |
International Conference |
CONFERENCE PAPER |
Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/Pd/Au surface finishes |
01/11/2007 |
National Conference |
CONFERENCE PAPER |
Study on Interfacial Reaction Between Lead-Free Solders and Alternative Surface Finishes |
01/11/2007 |
National Conference |
EDITORIAL ACTIVITITIES |
BOOKS |
UMP Publisher |
01/09/2020 |
Menyunting lapan topik artikel di dalam Buku Kokurikulum dan Pembangunan Mahasiswa Holistik |