PROFESOR MADYA TS. DR. SITI RABIATULL AISHA BINTI IDRIS

	Contact No. : 094246349 Gender : FEMALE Nationality : MALAYSIA Current Positon : DS54-A-PROFESOR MADYA E-Mail : rabiatull@ump.edu.my
ACADEMIC QUALIFICATION
. 2012 : IJAZAH KEDOKTORAN (DOCTORAL DEGREE), UNIVERSITI TEKNOLOGI MALAYSIA, SKUDAI . 2008 : IJAZAH SARJANA (MASTERS DEGREE), UNIVERSITI TEKNOLOGI MALAYSIA, SKUDAI . 2007 : IJAZAH SARJANA MUDA (BACHELOR DEGREE), UNIVERSITI TEKNOLOGI MALAYSIA, SKUDAI
EXPERTISE
EXPERT AREA MAJOR YEARS OF EXPERTISE LEVEL ADVANCED MATERIALS-COMPOSITE SPECIAL ALLOYS - 10 SANGAT TINGGI ALLOY MATERIALS MECHANICAL-MATERIALS 10 SANGAT TINGGI CASTING MECHANICAL-MATERIALS 10 SANGAT TINGGI ELECTRONIC PACKAGING MATERIALS MECHANICAL-MATERIALS 10 SANGAT TINGGI HEAT TREATMENT MECHANICAL-MATERIALS 10 SANGAT TINGGI LASER TECHNOLOGY MECHANICAL-MATERIALS 5 TINGGI METALLURGY PROCESS MECHANICAL-MATERIALS 10 SANGAT TINGGI METALS AND METAL ALLOY MATERIALS MECHANICAL-MATERIALS 10 SANGAT TINGGI MICROELECTRONICS MECHANICAL-MATERIALS 10 SANGAT TINGGI
EMPLOYMENT HISTORY
EMPLOYER POST JOIN DATE RESIGN DATE STATUS Institut Tunas Bakti TEACHER 01/05/2004 31/07/2004 SEMENTARA Universiti Teknologi Malaysia RESEARCH ASSISTANT 01/05/2006 31/10/2006 KONTRAK Universiti Teknologi Malaysia PEMBANTU FELO 01/01/2007 31/01/2008 KONTRAK Starza Corporation Sdn. Bhd TRAINER 01/03/2008 31/12/2010 SEMENTARA Universiti Tun Hussein Onn Malaysia LECTURER 01/09/2011 31/01/2012 SEMENTARA
RESEARCH
NO. TITLE ROLE START DATE END DATE STATUS 1. A STUDY ON EVALUATING THE EFFECTIVENESS AND FEASIBILITY OF SOLAR-POWERED ALTERNATIVES IN REPLACING TRADITIONAL ENERGY USAGE IN TIOMAN ISLAND Leader 01-FEB-2024 31-JAN-2025 Sedang Berjalan 2. A COMPREHENSIVE STUDY OF SOLAR MICROGRID SYSTEMS FOR SUSTAINABLE ELECTRIFICATION (UIC230829) Leader 29-DEC-2023 28-DEC-2024 Sedang Berjalan 3. A COMPREHENSIVE STUDY OF SOLAR MICROGRID SYSTEMS FOR SUSTAINABLE ELECTRIFICATION (RDU232414) Leader 29-DEC-2023 28-DEC-2024 Sedang Berjalan 4. INVESTIGATION ON THE IMPACT OF LASER TREATMENT ON CERAMIC MATERIALS TO ENHANCE ITS SURFACE DENSITY Leader 25-DEC-2023 24-DEC-2025 Sedang Berjalan 5. DESIGN AND INTEGRATION OF DYNAMICS FOCUSING GALVANOMETER SCANNER FOR LARGE SCAN FIELD LASER SURFACE TEXTURING MACHINE Member 15-NOV-2021 14-NOV-2023 Sedang Berjalan 6. A STUDY ON INTERFACIAL MICROSTRUCTURE GROWTH Leader 10-DEC-2020 09-DEC-2022 Tamat (Perlu hantar laporan akhir) 7. Microstructure evolution and rheological properties of semisolid Al-Si cast alloys for automotive application Member 01-SEP-2019 30-MAY-2022 Selesai (Tidak Mencapai KPI) 8. A STUDY ON THE EFFECTS OF GRAPHENE NANOSHEET ADDITIONS ON SnCuAg ALLOYS DURING LASER SOLDERING Leader 11-JAN-2019 31-DEC-2019 Selesai (Mencapai Semua KPI) 9. Joint Strengthening Mechanism Between Green Solder Alloy and Copper Board Produced Using Laser Soldering Leader 01-JAN-2019 30-SEP-2021 Selesai (Tidak Mencapai KPI) 10. Influence of laser-welding parameters on microstructure and mechanical properties of ultra-high strength 22MnB5 boron steel Member 01-JAN-2019 30-SEP-2022 Selesai (Tidak Mencapai KPI) 11. Thermal-Mechanical Coupled Modelling of Hot Press Forming Die Inserts Member 15-OCT-2018 14-JAN-2021 Tamat (Laporan akhir dikembalikan dan perlu dihantar semula) 12. CHARACTERIZATION OF WELD PENETRATION BY SOUND WAVE ACQUIRED DURING FIBER LASER WELDING PROCESS Member 01-APR-2018 31-MAR-2020 Selesai (Mencapai Semua KPI) 13. Effect of Nano reinforced structural adhesive for joining Aluminum alloy on Mechanical Properties Member 20-SEP-2017 19-SEP-2019 Selesai (Mencapai Semua KPI) 14. INVESTIGATION OF FILLERS ON WELDING PROPERTIES BETWEEN ALUMINIUM ALLOY AND MAGNESIUM ALLOY WELD BY METAL INERT GAS (MIG) WELDING Member 15-MAY-2017 14-MAY-2019 Selesai (Mencapai Semua KPI) 15. Investigation of microstructure development and corrosion performance of friction stir welded light alloys Member 25-JUN-2016 24-JUN-2018 Selesai (Mencapai Semua KPI) 16. EFFECT OF FIBRE LASER PARAMETERS ONTO SOLDER ALLOY JOINING PROPERTIES Leader 25-MAY-2016 24-MAY-2018 Selesai (Mencapai Semua KPI) 17. Development of Force and Temperature Controlled Friction Stir Welding Machine (FSW) For Dissimilar Metal Joining Application Member 01-DEC-2015 30-NOV-2017 Selesai (Mencapai Semua KPI) 18. Effect of Laser Welding parameters on dissimilar welded Austenitic and Duplex Stainless Steel for Tailor-Welded Blank application Member 01-OCT-2015 30-SEP-2017 Tamat (Tutup Projek) 19. Enhancement of solder Alloy Strength using Different Sn, Ag, Cu Composition through Mechanical Mixing Leader 15-AUG-2015 14-AUG-2017 Selesai (Mencapai Semua KPI) 20. Development of a Solder ally (Sn-Cu-Ni) for Electrical Connection at Automotive Electronic Devices using Powder Metallurgy Method Leader 15-NOV-2014 14-NOV-2016 Tamat (Tutup Projek) 21. Development of Welded Stiffener Plates using Dissimilar and Similar Metal Joining Technique Member 25-OCT-2014 24-OCT-2016 Tamat (Tutup Projek) 22. Dissimilar Metal Joining Of Aluminum And Magnesium Based Alloy By Gas Metal Arc Spot Welding Technique Member 01-JUL-2014 30-JUN-2017 Tamat (Tutup Projek) 23. Effect of Nickel Surface Finish on Solder Joint Reliability Leader 25-FEB-2014 24-FEB-2016 Selesai (Mencapai Semua KPI) 24. Effect of Nickel Doping on Immersion Gold Surface Finish Leader 25-FEB-2014 24-FEB-2016 Selesai (Mencapai Semua KPI) 25. Characterizing Of Electrical And Thermal Characteristic Of Piezoelectric Ultrasonic Motor For A Better Speed And Torque Performance Member 01-DEC-2013 30-NOV-2016 Selesai (Tidak Mencapai KPI) 26. Solder Joint Reliability Between Lead Free Solder and Direct Immersion Gold Surface Finish for Automotive Electronic Devices Application Leader 01-APR-2013 31-MAR-2015 Selesai (Mencapai Semua KPI) 27. Enhancement of Weldability in Light Alloys (A6061 & A7075) Dissimilar Metal Welding Member 01-APR-2013 31-MAR-2015 Selesai (Tidak Mencapai KPI) 28. New Type Of Coating Material For Automotive Electronic Devices Application Leader 01-JUN-2012 31-MAY-2014 Tamat (Perlu hantar laporan akhir) 29. Development Of A New Technique To Weld Dissimilar Metals For Automotive Applications Member 01-JUN-2012 31-MAY-2014 Selesai (Mencapai Semua KPI) 30. Modelling and Performance Characteristics of Finned Flat Tubes Heat Exchanger Member 01-MAY-2012 30-APR-2015 Selesai (Mencapai Semua KPI)
PUBLICATION
TYPE PUBLICATION TARIKH PENERBITAN TYPE OF CONTRIBUTION REFEREED PUBLICATION BOOK CHAPTER The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth 01/03/2022 Menulis bab dari buku (SCOPUS) CONFERENCE PAPER Effect of Different Nickel Percentage in Solder Alloy towards Intermetallic Compound Formation and Growth 01/03/2021 International Conference (SCOPUS) BOOK CHAPTER Kokurikulum dan Pembangunan Mahasiswa Holistik: Teras Tumpuan Dalam Kursus Kokurikulum 01/09/2020 Chapter in book BOOK CHAPTER A Review on Mechanical Properties of SnAgCu/Cu Joint Using Laser Soldering 01/03/2019 Chapter in book (SCOPUS) BOOK CHAPTER The Effect of Argon Shielding Gas Flow Rate on Welded 22MnB5 Boron Steel Using Low Power Fiber Laser 01/04/2019 Chapter in book (SCOPUS) CONFERENCE PAPER Effect of Different Amount of Silicon Carbide on SAC Solder-Cu Joint Performance by Using Microwave Hybrid Heating Method 01/01/2019 International Conference (SCOPUS) CONFERENCE PAPER Effect of fibre-lasers parameters on interfacial reaction and wetting angle of two different types of SAC305 solder fabrication on Cu pad 01/01/2019 International Conference (SCOPUS) JOURNAL Characterization of heat-treated gas metal arc-welded boron steel sheets 01/01/2018 International Journal (ISI, Q2) CONFERENCE PAPER A Study on The Development of Local Exhaust Ventilation System (LEV’s) for Installation of Laser Cutting Machine 01/09/2017 International conference (SCOPUS) CONFERENCE PAPER Hardness variation of welded boron steel using continuous wave (CW) and pulse wave (PW) mode of fiber laser 01/09/2017 International conference (SCOPUS) CONFERENCE PAPER Investigation on the Effect of Pulsed Energy on Strength of Fillet Lap Laser Welded AZ31B Magnesium Alloys 01/09/2017 International Conference (SCOPUS) CONFERENCE PAPER Optimization on Laser Soldering Parameters Onto Lead-Free Solder Joint 01/09/2017 International Conference (SCOPUS) JOURNAL Dissimilar welding of A7075-T651 and AZ31B alloy by gas metal arc plug welding method 02/01/2017 International journal (ISI, Q2) JOURNAL Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy 02/01/2017 International Journal (SCOPUS) JOURNAL The effect of pulse welding parameters on weld geometry of boron steel using low power fibre laser 01/09/2017 International Journal (SCOPUS) BOOK CHAPTER A review on the effect of surface finish and cooling rate on solder joint reliability 01/01/2016 Chapter in book BOOKS The effect of ER4043 and ER5356 filler metal on welded Al 7075 by metal inert gas welding 28/11/2016 Chapter in book CONFERENCE PAPER Effects of sintering temperatures on microstructures and mechanical properties of Sn4.0Ag0.5Cu1.0Ni solder alloy 01/12/2016 International Conference (SCOPUS) CONFERENCE PAPER Wettability Study of Lead Free Solder Paste and Its Effect Towards Multiple Reflow 01/12/2016 International Conference (SCOPUS) CONFERENCE PAPER Wettability study of lead free solder paste and its effect towards multiple reflow 01/08/2016 International conference (SCOPUS) JOURNAL A review: lead free solder and its wettability properties 19/01/2016 International journal (ISI, Q4) JOURNAL Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish 04/01/2016 International Journal (SCOPUS) JOURNAL Dissimilar welding of A7075-T651 and AZ31B alloys by gasmetal arc plug welding method 30/05/2016 International journal (ISI, Q2) JOURNAL Effect of Immersion Coating Deposition Time on Solder Joint Properties 01/04/2016 International journal (SCOPUS) JOURNAL Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish 11/07/2016 International journal (SCOPUS) JOURNAL Intermetallic growth and shear strength of SAC305/EN-Boron 21/01/2016 International journal (ISI, Q4) CONFERENCE PAPER Effect of Flux onto Intermetallic Compound Formation and Growth 01/08/2015 International conference (SCOPUS) JOURNAL Effect of reflow soldering profile on intermetallic compound formation 01/04/2015 International journal (SCOPUS) JOURNAL Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes 01/12/2015 International Journal (SCOPUS) CONFERENCE PAPER Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy 01/04/2014 International Conference (SCOPUS) CONFERENCE PAPER Microstructure Evolution at the Solder Joint During Isothermal Aging 11/11/2014 International Conference (SCOPUS) JOURNAL Effect Of Solder Volume On Interfacial Reaction Between SAC405 Solders And EN(B)EPIG Surface Finish 01/12/2014 International Journal (SCOPUS) JOURNAL Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating 09/09/2014 International journal (SCOPUS) JOURNAL Study of resistance spot welding between aisi 301 stainless steel and AISI 1020 carbon steel dissimilar alloys 01/06/2014 International Journal (SCOPUS) JOURNAL Effect of Reinforcement Alignment to the Properties of Polymer Matrix Composite 01/06/2013 International Journal (SCOPUS) JOURNAL Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5 Cu solders 01/11/2013 International Journal (SCOPUS) JOURNAL Intermetallic evolution for isothermal aging up to 2000 hours on Sn-4Ag-0.5 Cu and Sn-37Pb solders with Ni/Au layers 01/07/2013 International Journal (SCOPUS) CONFERENCE PAPER Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper 08/11/2012 International Conference (SCOPUS) JOURNAL Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish 01/11/2012 International Journal (SCOPUS) JOURNAL Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate 01/12/2012 International Journal (SCOPUS) JOURNAL Effect of Rice Husk as Filler in Polymer Matrix Composites 01/06/2012 International Journal (SCOPUS) JOURNAL Effect of multiple reflow on IMC formation using various surface finishes 01/08/2012 International Journal (SCOPUS) JOURNAL Effect of Surface Finish on Intermetallic Compound Formation During Soldering With Ni-Doped Solders 01/12/2011 International Journal (ISI, Q2) CONFERENCE PAPER Effect of Surface Finish Metallurgy on Intermetallic Compounds During Soldering with Tin-Silver-Copper Solders 12/07/2010 International Conference (SCOPUS) CONFERENCE PAPER Interfacial Reactions of SAC305 and SAC405 Solders on Electroless Ni(P)/ Immersion Au and Electroless Ni(B)/ Immersion Au Finishes 02/12/2010 International Conference (SCOPUS) JOURNAL Effect Of Solder Bump Size On Interfacial Reactions During Soldering Between Pb-Free Solder And Cu And Cu Ni/Pd/Au Surface Finishes 01/05/2010 International Journal (SCOPUS) JOURNAL Effect of Silver Content on Intermetallics Formation On Copper and Immersion Silver Surface Finishes 01/12/2009 International Journal CONFERENCE PAPER Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish 01/11/2006 International Conference (SCOPUS) NON-REFEREED PUBLICATION BOOK CHAPTER Kokurikulum Institusi Pengajian Tinggi Malaysia: Kokurikulum Institusi Pengajian Tinggi 01/09/2020 Chapter in book BOOK CHAPTER Kokurikulum Institusi Pengajian Tinggi Malaysia: Masa Depan Kursus Kokurikulum 01/09/2020 Chapter in book CONFERENCE PAPER Keberkesanan Program Latihan Luar Iaitu Selaman Scuba Di Lautan Terbuka Ke Atas Pembangunan Diri Pelatih Kor-Suksis Universiti Malaysia Pahang 01/01/2019 National Conference CONFERENCE PAPER Penglibatan Pelatih Kor-Suksis Dalam Aktiviti Perkhemahan Dan Sumbangannya Ke Arah Ketahanan Mental Dan Fizikal 01/01/2019 National conference CONFERENCE PAPER Penglibatan Mahasiswa Gen-Z Dalam Kegiatan Kokurikulum Kampus: Isu Dan Cabaran 01/01/2018 National conference JOURNAL The Mechanical And Microstructural Study of Welded AA7075 Using Different Filler Metals 01/09/2017 International journal BOOKS BMM3611 MANUFACTURING PROCESS LABORATORY 01/09/2016 Module for laboratory JOURNAL The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation 01/12/2016 International journal CONFERENCE PAPER A review on effect of nickel doping on solder joint reliability 01/01/2015 National Conference JOURNAL Development Of Diffusion Barrier Layer On Copper-printed Circuit Board Using Electroless Plating Method 30/04/2015 International journal CONFERENCE PAPER Effect of Bismuth Percentage on Intermetallic Compound Formation with Immersion Silver and Copper Surface Finishes 02/11/2009 International Conference CONFERENCE PAPER Effect of Multiple Reflow On Intermetallic Compound Formation on Copper and Immersion Silver Surface Finishes 01/12/2009 International Conference CONFERENCE PAPER Effect of Nickel Doping in Sn-Ag-Cu Solders on Intermetallic Compound Formation with Immersion Silver and Copper Surface Finishes 02/11/2009 International Conference CONFERENCE PAPER Effect of Silver Content on Intermetallics Formation on Copper and Immersion Silver Surface Finishes 30/04/2009 International Conference CONFERENCE PAPER Effect of Solder Volume and Pad Area on Intermetallic Compounds Formation During Soldering Between Sn-4Ag-0.5Cu and Immersion Silver Finish 02/03/2009 International Conference CONFERENCE PAPER Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/Pd/Au surface finishes 01/11/2007 National Conference CONFERENCE PAPER Study on Interfacial Reaction Between Lead-Free Solders and Alternative Surface Finishes 01/11/2007 National Conference EDITORIAL ACTIVITITIES BOOKS UMP Publisher 01/09/2020 Menyunting lapan topik artikel di dalam Buku Kokurikulum dan Pembangunan Mahasiswa Holistik