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Home> FKM1000-FAKULTI KEJURUTERAAN MEKANIKAL

DR. SITI RABIATULL AISHA BINTI IDRIS

Contact No. : 094246349
Gender : FEMALE
Nationality : MALAYSIA
Current Positon : DS51-A-PENSYARAH UNIVERSITI
E-Mail : rabiatull@ump.edu.my
 
ACADEMIC QUALIFICATION
. 2012 : IJAZAH KEDOKTORAN (DOCTORAL DEGREE), UNIVERSITI TEKNOLOGI MALAYSIA, SKUDAI
. 2008 : IJAZAH SARJANA (MASTERS DEGREE), UNIVERSITI TEKNOLOGI MALAYSIA, SKUDAI
. 2007 : IJAZAH SARJANA MUDA (BACHELOR DEGREE), UNIVERSITI TEKNOLOGI MALAYSIA, SKUDAI
 
EXPERTISE
EXPERT AREA MAJOR YEARS OF EXPERTISE LEVEL
ALLOY MATERIALS MECHANICAL-MATERIALS
10
SANGAT TINGGI
CASTING MECHANICAL-MATERIALS
3
TINGGI
ELECTRONIC PACKAGING MATERIALS MECHANICAL-MATERIALS
10
SANGAT TINGGI
HEAT TREATMENT MECHANICAL-MATERIALS
10
SANGAT TINGGI
LASER TECHNOLOGY MECHANICAL-MATERIALS
2
TINGGI
METALLURGY PROCESS MECHANICAL-MATERIALS
10
SANGAT TINGGI
METALS AND METAL ALLOY MATERIALS MECHANICAL-MATERIALS
10
SANGAT TINGGI
MICROELECTRONICS MECHANICAL-MATERIALS
10
SANGAT TINGGI
 
EMPLOYMENT HISTORY
EMPLOYER POST JOIN DATE RESIGN DATE STATUS
Institut Tunas Bakti TEACHER 01/05/2004 31/07/2004 SEMENTARA
Universiti Teknologi Malaysia RESEARCH ASSISTANT 01/05/2006 31/10/2006 KONTRAK
Universiti Teknologi Malaysia PEMBANTU FELO 01/01/2007 31/01/2008 KONTRAK
Starza Corporation Sdn. Bhd TRAINER 01/03/2008 31/12/2010 SEMENTARA
Universiti Tun Hussein Onn Malaysia LECTURER 01/09/2011 31/01/2012 SEMENTARA
   
RESEARCH
NO. TITLE ROLE START DATE END DATE STATUS
1. CHARACTERIZATION OF WELD PENETRATION BY SOUND WAVE ACQUIRED DURING FIBER LASER WELDING PROCESS Member 01-APR-2018 31-MAR-2020 Sedang Berjalan
2. Effect of Nano reinforced structural adhesive for joining Aluminum alloy on Mechanical Properties Member 20-SEP-2017 19-SEP-2019 Sedang Berjalan
3. INVESTIGATION OF FILLERS ON WELDING PROPERTIES BETWEEN ALUMINIUM ALLOY AND MAGNESIUM ALLOY WELD BY METAL INERT GAS (MIG) WELDING Member 15-MAY-2017 14-MAY-2019 Sedang Berjalan
4. Investigation of microstructure development and corrosion performance of friction stir welded light alloys Member 25-JUN-2016 24-JUN-2018 Tamat
5. EFFECT OF FIBRE LASER PARAMETERS ONTO SOLDER ALLOY JOINING PROPERTIES Leader 25-MAY-2016 24-MAY-2018 Sedang Berjalan
6. Development of Force and Temperature Controlled Friction Stir Welding Machine (FSW) For Dissimilar Metal Joining Application Member 01-DEC-2015 30-NOV-2017 Tamat
7. Effect of Laser Welding parameters on dissimilar welded Austenitic and Duplex Stainless Steel for Tailor-Welded Blank application Member 01-OCT-2015 30-SEP-2017 Tamat
8. Enhancement of solder Alloy Strength using Different Sn, Ag, Cu Composition through Mechanical Mixing Leader 15-AUG-2015 14-AUG-2017 Tamat
9. Development of a Solder ally (Sn-Cu-Ni) for Electrical Connection at Automotive Electronic Devices using Powder Metallurgy Method Leader 15-NOV-2014 14-NOV-2016 Selesai (Tutup Projek)
10. Development of Welded Stiffener Plates using Dissimilar and Similar Metal Joining Technique Member 25-OCT-2014 24-OCT-2016 Selesai (Tutup Projek)
11. Dissimilar Metal Joining Of Aluminum And Magnesium Based Alloy By Gas Metal Arc Spot Welding Technique Member 01-JUL-2014 30-JUN-2017 Selesai (Tutup Projek)
12. Effect of Nickel Doping on Immersion Gold Surface Finish Leader 25-FEB-2014 24-FEB-2016 Tamat
13. Effect of Nickel Surface Finish on Solder Joint Reliability Leader 25-FEB-2014 24-FEB-2016 Tamat
14. Characterizing Of Electrical And Thermal Characteristic Of Piezoelectric Ultrasonic Motor For A Better Speed And Torque Performance Member 01-DEC-2013 30-NOV-2016 Selesai (Tutup Projek)
15. Enhancement of Weldability in Light Alloys (A6061 & A7075) Dissimilar Metal Welding Member 01-APR-2013 31-MAR-2015 Selesai
16. Solder Joint Reliability Between Lead Free Solder and Direct Immersion Gold Surface Finish for Automotive Electronic Devices Application Leader 01-APR-2013 31-MAR-2015 Selesai
17. New Type Of Coating Material For Automotive Electronic Devices Application Leader 01-JUN-2012 31-MAY-2014 Tamat
18. Development Of A New Technique To Weld Dissimilar Metals For Automotive Applications Member 01-JUN-2012 31-MAY-2014 Selesai
19. Modelling and Performance Characteristics of Finned Flat Tubes Heat Exchanger Member 01-MAY-2012 30-APR-2015 Selesai
   
PUBLICATION
TYPE PUBLICATION TARIKH PENERBITAN TYPE OF CONTRIBUTION
NON-REFEREED PUBLICATION
BOOKS BMM3611 MANUFACTURING PROCESS LABORATORY 01/09/2016 Module for laboratory
JOURNAL The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation 01/12/2016 International journal
CONFERENCE PAPER A review on effect of nickel doping on solder joint reliability 01/01/2015 National Conference
JOURNAL Development Of Diffusion Barrier Layer On Copper-printed Circuit Board Using Electroless Plating Method 30/04/2015 International journal
CONFERENCE PAPER Effect of Bismuth Percentage on Intermetallic Compound Formation with Immersion Silver and Copper Surface Finishes 02/11/2009 International Conference
CONFERENCE PAPER Effect of Multiple Reflow On Intermetallic Compound Formation on Copper and Immersion Silver Surface Finishes 01/12/2009 International Conference
CONFERENCE PAPER Effect of Nickel Doping in Sn-Ag-Cu Solders on Intermetallic Compound Formation with Immersion Silver and Copper Surface Finishes 02/11/2009 International Conference
CONFERENCE PAPER Effect of Silver Content on Intermetallics Formation on Copper and Immersion Silver Surface Finishes 30/04/2009 International Conference
CONFERENCE PAPER Effect of Solder Volume and Pad Area on Intermetallic Compounds Formation During Soldering Between Sn-4Ag-0.5Cu and Immersion Silver Finish 02/03/2009 International Conference
CONFERENCE PAPER Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/Pd/Au surface finishes 01/11/2007 National Conference
CONFERENCE PAPER Study on Interfacial Reaction Between Lead-Free Solders and Alternative Surface Finishes 01/11/2007 National Conference
REFEREED PUBLICATION
BOOK CHAPTER A review on the effect of surface finish and cooling rate on solder joint reliability 01/01/2016 Chapter in book
BOOKS The effect of ER4043 and ER5356 filler metal on welded Al 7075 by metal inert gas welding 28/11/2016 Chapter in book
CONFERENCE PAPER Effects of sintering temperatures on microstructures and mechanical properties of Sn4.0Ag0.5Cu1.0Ni solder alloy 01/12/2016 International Conference (SCOPUS)
CONFERENCE PAPER Wettability Study of Lead Free Solder Paste and Its Effect Towards Multiple Reflow 01/12/2016 International Conference (SCOPUS)
CONFERENCE PAPER Wettability study of lead free solder paste and its effect towards multiple reflow 01/08/2016 International conference (SCOPUS)
JOURNAL A review: lead free solder and its wettability properties 19/01/2016 International journal (ISI, Q4)
JOURNAL Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish 04/01/2016 International Journal (SCOPUS)
JOURNAL Dissimilar welding of A7075-T651 and AZ31B alloys by gasmetal arc plug welding method 30/05/2016 International journal (ISI, Q2)
JOURNAL Effect of Immersion Coating Deposition Time on Solder Joint Properties 01/04/2016 International journal (SCOPUS)
JOURNAL Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish 11/07/2016 International journal (SCOPUS)
JOURNAL Intermetallic growth and shear strength of SAC305/EN-Boron 21/01/2016 International journal (ISI, Q4)
CONFERENCE PAPER Effect of Flux onto Intermetallic Compound Formation and Growth 01/08/2015 International conference (SCOPUS)
JOURNAL Effect of reflow soldering profile on intermetallic compound formation 01/04/2015 International journal (SCOPUS)
JOURNAL Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes 01/12/2015 International Journal (SCOPUS)
CONFERENCE PAPER Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy 01/04/2014 International Conference (SCOPUS)
CONFERENCE PAPER Microstructure Evolution at the Solder Joint During Isothermal Aging 11/11/2014 International Conference (SCOPUS)
JOURNAL Effect Of Solder Volume On Interfacial Reaction Between SAC405 Solders And EN(B)EPIG Surface Finish 01/12/2014 International Journal (SCOPUS)
JOURNAL Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating 09/09/2014 International journal (SCOPUS)
JOURNAL Study of resistance spot welding between aisi 301 stainless steel and AISI 1020 carbon steel dissimilar alloys 01/06/2014 International Journal (SCOPUS)
JOURNAL Effect of Reinforcement Alignment to the Properties of Polymer Matrix Composite 01/06/2013 International Journal (SCOPUS)
JOURNAL Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5 Cu solders 01/11/2013 International Journal (SCOPUS)
JOURNAL Intermetallic evolution for isothermal aging up to 2000 hours on Sn-4Ag-0.5 Cu and Sn-37Pb solders with Ni/Au layers 01/07/2013 International Journal (SCOPUS)
CONFERENCE PAPER Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper 08/11/2012 International Conference (SCOPUS)
JOURNAL Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish 01/11/2012 International Journal (SCOPUS)
JOURNAL Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate 01/12/2012 International Journal (SCOPUS)
JOURNAL Effect of Rice Husk as Filler in Polymer Matrix Composites 01/06/2012 International Journal (SCOPUS)
JOURNAL Effect of multiple reflow on IMC formation using various surface finishes 01/08/2012 International Journal (SCOPUS)
JOURNAL Effect of Surface Finish on Intermetallic Compound Formation During Soldering With Ni-Doped Solders 01/12/2011 International Journal (ISI, Q2)
CONFERENCE PAPER Effect of Surface Finish Metallurgy on Intermetallic Compounds During Soldering with Tin-Silver-Copper Solders 12/07/2010 International Conference (SCOPUS)
CONFERENCE PAPER Interfacial Reactions of SAC305 and SAC405 Solders on Electroless Ni(P)/ Immersion Au and Electroless Ni(B)/ Immersion Au Finishes 02/12/2010 International Conference (SCOPUS)
JOURNAL Effect Of Solder Bump Size On Interfacial Reactions During Soldering Between Pb-Free Solder And Cu And Cu Ni/Pd/Au Surface Finishes 01/05/2010 International Journal (SCOPUS)
JOURNAL Effect of Silver Content on Intermetallics Formation On Copper and Immersion Silver Surface Finishes 01/12/2009 International Journal
CONFERENCE PAPER Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish 01/11/2006 International Conference (SCOPUS)
   

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