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Home> FKM1000-FAKULTI KEJURUTERAAN MEKANIKAL

DR. SITI RABIATULL AISHA BINTI IDRIS

Contact No. : 094246349
Gender : FEMALE
Nationality : MALAYSIA
Current Positon : DS51-A-PENSYARAH UNIVERSITI
E-Mail : rabiatull@ump.edu.my
 
ACADEMIC QUALIFICATION
. 2012 : IJAZAH KEDOKTORAN (DOCTORAL DEGREE), UNIVERSITI TEKNOLOGI MALAYSIA, SKUDAI
. 2008 : IJAZAH SARJANA (MASTERS DEGREE), UNIVERSITI TEKNOLOGI MALAYSIA, SKUDAI
. 2007 : IJAZAH SARJANA MUDA (BACHELOR DEGREE), UNIVERSITI TEKNOLOGI MALAYSIA, SKUDAI
 
EXPERTISE
EXPERT AREA MAJOR YEARS OF EXPERTISE LEVEL
ALLOY MATERIALS MECHANICAL-MATERIALS
10
SANGAT TINGGI
CASTING MECHANICAL-MATERIALS
3
TINGGI
ELECTRONIC PACKAGING MATERIALS MECHANICAL-MATERIALS
10
SANGAT TINGGI
HEAT TREATMENT MECHANICAL-MATERIALS
10
SANGAT TINGGI
LASER TECHNOLOGY MECHANICAL-MATERIALS
2
TINGGI
METALLURGY PROCESS MECHANICAL-MATERIALS
10
SANGAT TINGGI
METALS AND METAL ALLOY MATERIALS MECHANICAL-MATERIALS
10
SANGAT TINGGI
MICROELECTRONICS MECHANICAL-MATERIALS
10
SANGAT TINGGI
 
EMPLOYMENT HISTORY
No Record.

   
RESEARCH
NO. TITLE ROLE START DATE END DATE STATUS
1. Effect of Nano reinforced structural adhesive for joining Aluminum alloy on Mechanical Properties Member 20-SEP-2017 19-SEP-2019 Sedang Berjalan
2. INVESTIGATION OF FILLERS ON WELDING PROPERTIES BETWEEN ALUMINIUM ALLOY AND MAGNESIUM ALLOY WELD BY METAL INERT GAS (MIG) WELDING Member 15-MAY-2017 14-MAY-2019 Sedang Berjalan
3. Investigation of microstructure development and corrosion performance of friction stir welded light alloys Member 25-JUN-2016 24-JUN-2018 Sedang Berjalan
4. EFFECT OF FIBRE LASER PARAMETERS ONTO SOLDER ALLOY JOINING PROPERTIES Leader 25-MAY-2016 24-MAY-2018 Sedang Berjalan
5. Development of Force and Temperature Controlled Friction Stir Welding Machine (FSW) For Dissimilar Metal Joining Application Member 01-DEC-2015 30-NOV-2017 Sedang Berjalan
6. Effect of Laser Welding parameters on dissimilar welded Austenitic and Duplex Stainless Steel for Tailor-Welded Blank application Member 01-OCT-2015 30-SEP-2017 Tamat
7. Enhancement of solder Alloy Strength using Different Sn, Ag, Cu Composition through Mechanical Mixing Leader 15-AUG-2015 14-AUG-2017 Tamat
8. Development of a Solder ally (Sn-Cu-Ni) for Electrical Connection at Automotive Electronic Devices using Powder Metallurgy Method Leader 15-NOV-2014 14-NOV-2016 Selesai (Tutup Projek)
9. Development of Welded Stiffener Plates using Dissimilar and Similar Metal Joining Technique Member 25-OCT-2014 24-OCT-2016 Selesai (Tutup Projek)
10. Dissimilar Metal Joining Of Aluminum And Magnesium Based Alloy By Gas Metal Arc Spot Welding Technique Member 01-JUL-2014 30-JUN-2017 Tamat
11. Effect of Nickel Surface Finish on Solder Joint Reliability Leader 25-FEB-2014 24-FEB-2016 Tamat
12. Effect of Nickel Doping on Immersion Gold Surface Finish Leader 25-FEB-2014 24-FEB-2016 Tamat
13. Characterizing Of Electrical And Thermal Characteristic Of Piezoelectric Ultrasonic Motor For A Better Speed And Torque Performance Member 01-DEC-2013 30-NOV-2016 Selesai (Tutup Projek)
14. Solder Joint Reliability Between Lead Free Solder and Direct Immersion Gold Surface Finish for Automotive Electronic Devices Application Leader 01-APR-2013 31-MAR-2015 Selesai
15. Enhancement of Weldability in Light Alloys (A6061 & A7075) Dissimilar Metal Welding Member 01-APR-2013 31-MAR-2015 Selesai
16. Development Of A New Technique To Weld Dissimilar Metals For Automotive Applications Member 01-JUN-2012 31-MAY-2014 Selesai
17. New Type Of Coating Material For Automotive Electronic Devices Application Leader 01-JUN-2012 31-MAY-2014 Tamat
18. Modelling and Performance Characteristics of Finned Flat Tubes Heat Exchanger Member 01-MAY-2012 30-APR-2015 Selesai
   
PUBLICATION
TYPE PUBLICATION TARIKH PENERBITAN TYPE OF CONTRIBUTION
NON-REFEREED PUBLICATION
BOOKS BMM3611 MANUFACTURING PROCESS LABORATORY 01/09/2016 Module for laboratory
JOURNAL The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation 01/12/2016 International journal
CONFERENCE PAPER A review on effect of nickel doping on solder joint reliability 01/01/2015 National Conference
JOURNAL Development Of Diffusion Barrier Layer On Copper-printed Circuit Board Using Electroless Plating Method 30/04/2015 International journal
CONFERENCE PAPER Effect of Bismuth Percentage on Intermetallic Compound Formation with Immersion Silver and Copper Surface Finishes 02/11/2009 International Conference
CONFERENCE PAPER Effect of Multiple Reflow On Intermetallic Compound Formation on Copper and Immersion Silver Surface Finishes 01/12/2009 International Conference
CONFERENCE PAPER Effect of Nickel Doping in Sn-Ag-Cu Solders on Intermetallic Compound Formation with Immersion Silver and Copper Surface Finishes 02/11/2009 International Conference
CONFERENCE PAPER Effect of Silver Content on Intermetallics Formation on Copper and Immersion Silver Surface Finishes 30/04/2009 International Conference
CONFERENCE PAPER Effect of Solder Volume and Pad Area on Intermetallic Compounds Formation During Soldering Between Sn-4Ag-0.5Cu and Immersion Silver Finish 02/03/2009 International Conference
CONFERENCE PAPER Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/Pd/Au surface finishes 01/11/2007 National Conference
CONFERENCE PAPER Study on Interfacial Reaction Between Lead-Free Solders and Alternative Surface Finishes 01/11/2007 National Conference
REFEREED PUBLICATION
BOOK CHAPTER A review on the effect of surface finish and cooling rate on solder joint reliability 01/01/2016 Chapter in book
BOOKS The effect of ER4043 and ER5356 filler metal on welded Al 7075 by metal inert gas welding 28/11/2016 Chapter in book
CONFERENCE PAPER Effects of sintering temperatures on microstructures and mechanical properties of Sn4.0Ag0.5Cu1.0Ni solder alloy 01/12/2016 International Conference (SCOPUS)
CONFERENCE PAPER Wettability Study of Lead Free Solder Paste and Its Effect Towards Multiple Reflow 01/12/2016 International Conference (SCOPUS)
CONFERENCE PAPER Wettability study of lead free solder paste and its effect towards multiple reflow 01/08/2016 International conference (SCOPUS)
JOURNAL A review: lead free solder and its wettability properties 19/01/2016 International journal (ISI, Q4)
JOURNAL Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish 04/01/2016 International Journal (SCOPUS)
JOURNAL Dissimilar welding of A7075-T651 and AZ31B alloys by gasmetal arc plug welding method 30/05/2016 International journal (ISI, Q2)
JOURNAL Effect of Immersion Coating Deposition Time on Solder Joint Properties 01/04/2016 International journal (SCOPUS)
JOURNAL Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish 11/07/2016 International journal (SCOPUS)
JOURNAL Intermetallic growth and shear strength of SAC305/EN-Boron 21/01/2016 International journal (ISI, Q4)
CONFERENCE PAPER Effect of Flux onto Intermetallic Compound Formation and Growth 01/08/2015 International conference (SCOPUS)
JOURNAL Effect of reflow soldering profile on intermetallic compound formation 01/04/2015 International journal (SCOPUS)
JOURNAL Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes 01/12/2015 International Journal (SCOPUS)
CONFERENCE PAPER Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy 01/04/2014 International Conference (SCOPUS)
CONFERENCE PAPER Microstructure Evolution at the Solder Joint During Isothermal Aging 11/11/2014 International Conference (SCOPUS)
JOURNAL Effect Of Solder Volume On Interfacial Reaction Between SAC405 Solders And EN(B)EPIG Surface Finish 01/12/2014 International Journal (SCOPUS)
JOURNAL Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating 09/09/2014 International journal (SCOPUS)
JOURNAL Study of resistance spot welding between aisi 301 stainless steel and AISI 1020 carbon steel dissimilar alloys 01/06/2014 International Journal (SCOPUS)
JOURNAL Effect of Reinforcement Alignment to the Properties of Polymer Matrix Composite 01/06/2013 International Journal (SCOPUS)
JOURNAL Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5 Cu solders 01/11/2013 International Journal (SCOPUS)
JOURNAL Intermetallic evolution for isothermal aging up to 2000 hours on Sn-4Ag-0.5 Cu and Sn-37Pb solders with Ni/Au layers 01/07/2013 International Journal (SCOPUS)
CONFERENCE PAPER Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper 08/11/2012 International Conference (SCOPUS)
JOURNAL Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish 01/11/2012 International Journal (SCOPUS)
JOURNAL Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate 01/12/2012 International Journal (SCOPUS)
JOURNAL Effect of Rice Husk as Filler in Polymer Matrix Composites 01/06/2012 International Journal (SCOPUS)
JOURNAL Effect of multiple reflow on IMC formation using various surface finishes 01/08/2012 International Journal (SCOPUS)
JOURNAL Effect of Surface Finish on Intermetallic Compound Formation During Soldering With Ni-Doped Solders 01/12/2011 International Journal (ISI, Q2)
CONFERENCE PAPER Effect of Surface Finish Metallurgy on Intermetallic Compounds During Soldering with Tin-Silver-Copper Solders 12/07/2010 International Conference (SCOPUS)
CONFERENCE PAPER Interfacial Reactions of SAC305 and SAC405 Solders on Electroless Ni(P)/ Immersion Au and Electroless Ni(B)/ Immersion Au Finishes 02/12/2010 International Conference (SCOPUS)
JOURNAL Effect Of Solder Bump Size On Interfacial Reactions During Soldering Between Pb-Free Solder And Cu And Cu Ni/Pd/Au Surface Finishes 01/05/2010 International Journal (SCOPUS)
JOURNAL Effect of Silver Content on Intermetallics Formation On Copper and Immersion Silver Surface Finishes 01/12/2009 International Journal
CONFERENCE PAPER Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish 01/11/2006 International Conference (SCOPUS)
   

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